Gigabyte GA X570 Aorus Master

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Description

Supports AMD Ryzenâ„¢ 5000 Series / 3rd Gen Ryzenâ„¢/ 2nd Gen Ryzenâ„¢/ 2nd Gen Ryzenâ„¢ with Radeonâ„¢ Vega Graphics/ Ryzenâ„¢ with Radeonâ„¢ Vega Graphics Processors
Dual Channel ECC/ Non-ECC Unbuffered DDR4, 4 DIMMs
Direct 14 Phases Infineon Digital VRM Solution with PowIRstage
Advanced Thermal Design with Fins-Array Heatsink and Direct Touch Heatpipe

DESIGN CONCEPT

DOMINANT IN DARKNESS

In the dark, starless night, the falcon strikes fear into the heart of its prey. Even with minimal visibility, the falcon pinpoints its prey and patiently anticipates the perfect moment to swoop in for the kill. The falcon with its laser sharp gaze dominates the darkness of night in the same manner that AORUS Core Lighting illuminates the vast AORUS ecosystem.

Direct 14 Phases Infineon Digital VRM Solution with PowIRstage

• 6-Layer 2X Copper PCIe 4.0 Mid-Loss Ready PCB
Intel® WiFi 6 802.11ax 2T2R & BT 5

Advanced Thermal Design

• Fins-Array Heatsink
• Direct Touch Heatpipe
• 5 W/mK LAIRD Thermal Conductivity Pad
• Thermal Baseplate
Realtek 2.5GbE LAN

Intel® GbE LAN

• cFosSpeed Internet Accelerator

Integrated I/O Shield

• Q-Flash Plus / Clear CMOS Buttons
DualBIOSâ„¢ with Socketed BIOS

Triple PCIe 4.0 x4 M.2 Connectors

• PCIe 4.0/3.0 x4 NVMe support
• Triple Thermal Guards

Audio Solutions

• ALC1220-VB Audio
• ESS 9118 SABRE DAC
• Gold Plated Audio Jacks
• High-End Audio Capacitors (WIMA & Nichicon Fine Gold)
Noise Detection

Supports AMD Ryzenâ„¢ Series Processors

• Dual Channel DDR4, 4 DIMMs with Ultra Durable Memory Armor

Solid Pin Power Connectors

• 24 pin ATX Power Connector
• 8+8 pin CPU Power Connector
Front USB 3.2 Gen2 Type-Câ„¢
PCIe 4.0 Turbo B-Clock IC

PCIe 4.0 Slots

• PCIe 4.0/3.0 x16, x8, x4 slots
• Ultra Durable PCIe Armor
USB TurboCharger

RGB FUSION 2.0

• Addressable LED Header*2
• RGB LED Header*2
GET READY FOR AMD RYZENâ„¢ 5000 SERIES
GIGABYTE X570 motherboards based on the AMD X570 Chipset provide full support for latest AMD Ryzen™ 5000 Series Processors. The all-new design is a testament to GIGABYTE dedication to design quality. GIGABYTE X570 motherboards offer a rich list of features such as support for PCIe 4.0, USB Type-C™ interfaces on select boards, refined audio, high speed of Ethernet and latest standard of WIFI design, to fulfill users’ performance, audio, and data transfer needs. The new, advanced power and thermal design enables users to unleash the performance on AMD Ryzen™ 5000 Series Processors, making the GIGABYTE X570 motherboards perfect for users looking to build the best AMD platform gaming system.AMD Ryzen™ 5000, 4000, 3000, 2000 Series Compatible
AMD StoreMI Technology

GIGABYTE X570 motherboards maximize your PC’s potential with AMD StoreMI technology. StoreMI accelerates traditional storage devices to reduce boot times and enhance the overall user experience. This easy-to-use utility combines the speed of SSDs with the high capacity of HDDs into a single drive, enhances the read/write speeds of the device to match that of SSDs, bolsters data performance for incredible value, and transforms the everyday PC to a performance driven system.

The benefits of AMD StoreMI:

• Making the PC experience fast, smooth and easy
• Optimizing computer responsiveness from system boot to application launch
• Offering SSD performance with HDD capacity at an affordable cost
• Quickly accessing key files by automatically learning users’ computing behaviors

AORUS PERFORMANCE
Ultimate Power Design
To unleash the full potential of the 3rd Generation of AMD Ryzenâ„¢ CPU, the motherboard requires the best CPU power design. With the best quality components and GIGABYTE R&D design capability, the X570 AORUS is a true beast among motherboards.
Direct 14 Phases Digital Power
Power Architecture
2X Copper PCB

Advanced Thermal Design
X570 AORUS MASTER reaches a perfect balance between style and performance by combining the media acclaimed Fins-Array heatsink, a heatpipe, and a thermal baseplate, to provide 30% lower MOSFET temperatures for enthusiasts, overclockers and professional gamers
Fins-Array Heatsink with Direct Touch Heatpipe and High Thermal Conductivity Pad
X570 AORUS MASTER uses Fins-Array Heatsink which increases the heat dissipation area by 300% compared to traditional heatsinks of the same size. Direct Touch Heatpipe helps transfer heat from MOS fins. By using LAIRD 1.5mm thick, 5W/mK high thermal conductivity pads, it can transfer 2.7x more heat compared to traditional thermal pads in the same time period.
Fins-Array
High Thermal Conductivity Pad
Thermal Baseplate

Direct Touch Heatpipe
Smart Chipset Fan Heatsink
Smart Fan
  1. Provides 3 different operating modes to minimize noise and extend the fan’s longevity. Silent, Balanced and Performance modes, choose the mode that suits you the best in any situation.
High Durability
  1. X570 motherboards adopt a high quality ball bearing fan which guarantees 60,000* working hours.
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